In today’s race for ultimate performance and portability, small computers have become a popular choice for home entertainment, office tasks, and professional uses due to their compact size and powerful computing capabilities. But as hardware performance keeps getting better, cooling problems have been coming up more and more, making a big limit to ryzen mini PCs getting better. Heat spreaders and liquid metal, as two new cooling ways, are now keeping the performance of ryzen mini PCs safe with their great cooling help.
Table of Contents
I. Even Heat Plate: A Leap In Thermal Performance
1. Working Principle
Even a heat plate is a kind of high-efficiency heat dissipation element using phase change heat transfer. Its interior is a vacuum cavity, filled with a low boiling point of the substance. When the heat source is conducted to the evaporation zone, the mass absorbs heat and evaporates, expanding rapidly and filling the entire cavity. Vapor in contact with the condensation zone condensation, release of heat, after condensation of the liquid through the action of capillary force back to the evaporation zone, the formation of a closed phase change heat transfer cycle.
2. Improvement of Heat Dissipation performance
The heat dissipation performance of the heat spreading plate not only depends on the latent heat of phase change of the internal work material but is also closely related to its internal structure. Its internal microstructure can provide strong capillary force to promote the reflux of the work material, thus improving the heat dissipation efficiency. Compared with the traditional heat pipe, the homogeneous heat plate has stronger thermal conductivity and better temperature uniformity. Heat pipes are one-dimensional linear heat transfer, while heat plates conduct heat on a two-dimensional surface, which can distribute heat more evenly and eliminate local hot spots. Studies have shown that the heat dissipation performance of a homogeneous heat plate is 20% – 30% higher than that of a heat pipe.
3. Application In Ryzen Mini PC
In high-performance ryzen mini PCs, heat-spreading boards can effectively cover key heat-generating components such as CPUs and GPUs, and evenly distribute the heat over a larger cooling area, thus reducing the temperature of the components.
II. Liquid Metal: A Breakthrough In Thermal Efficiency
1. Working Principle
Liquid metal heat dissipation mainly relies on the excellent thermal conductivity of liquid metal. Liquid metal usually refers to gallium-based alloys, whose thermal conductivity is much higher than that of traditional silicone grease. Liquid metals are liquid at room temperature and have good fluidity and thermal conductivity. When the heat source is conducted to the liquid metal, the liquid metal can quickly conduct the heat to the heat sink, thus improving the heat dissipation efficiency.
2. Improved Thermal Performance
The thermal conductivity of liquid metal is about tens of times higher than that of silicone grease, which can significantly improve the thermal conduction efficiency. This means that under the same conditions, liquid metal can more efficiently transfer the heat generated by the CPU or GPU to the heat sink, thus lowering the core temperature. Additionally, liquid metal maintains stable performance for a longer period and has a longer lifespan when properly packaged.
3. Application In Ryzen Mini PC
In Mini PC, liquid metal cooling technology can effectively reduce the peak temperature of the processor. For example, the peak GPU temperature of a ryzen mini PC using the R7-8845HS processor is 18°C lower than that of a traditional solution. This allows the device to maintain good performance during long periods of high-load operation, avoiding performance degradation or device damage due to overheating.
Thermal Technology For Ryzen Mini PC Ushers In A New Era
The radiator and liquid metal can both positively reinforce each other to work as an effective and stable cooling system in minicomputers. For instance, the liquid metal between the heat source and the heat distributor can improve its efficiency. This will enable quick transfer and dissipation of heat. At the same time, liquid metal local overheating can be well by the ability of the radiator to regulate temperature and hence, the performance degradation will be avoided; thus, making sure that the whole cooling system operates smoothly.
Among existing tools for high-performance processors reliable heat dissipation, good conducting heat energy fast, and efficient radiation performance, radiators, and liquid metal thermal management technology would be the best means for minicomputers.
With continuous technological development and optimization, these cooling technologies will be applied to more fields, providing a greater development space for electronic devices. In the future, we hope to see more innovative cooling technologies that offer more perfect solutions to the cooling problems of high-performance computing devices.
